Mechanical, thermal and microstructural properties of the low-Ag-content Sn-1Ag-0.5Cu solder alloy bearing Fe or A1 for electronics applications /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2013
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| Subjects: | |
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| LEADER | 01447cam a2200337 i 4500 | ||
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| 001 | u984506 | ||
| 003 | SIRSI | ||
| 005 | 201312030905 | ||
| 008 | 131203s2013 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ |e rda | ||
| 090 | |a TJ7 |b UMP 2013 Shn | ||
| 097 | |a TJ7 |b UMP 2013 Shn | ||
| 100 | 1 | |a Shnawah, Dhafer Abdul-Ameer | |
| 245 | 1 | 0 | |a Mechanical, thermal and microstructural properties of the low-Ag-content Sn-1Ag-0.5Cu solder alloy bearing Fe or A1 for electronics applications / |c Dhafer Abdul-Ameer Shnawah. |
| 264 | 1 | |c 2013 | |
| 264 | 4 | |c 2013 | |
| 300 | |a xx, 179 leaves : |b illustrations ; |c 30 cm. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |b Ph.D |c Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya |d 2013. | ||
| 504 | |a Bibliography: leaves 163-179. | ||
| 650 | 0 | |a Alloys |x Microstructure. | |
| 650 | 0 | |a Alloys |x Thermal properties. | |
| 650 | 0 | |a Microstructure. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik, |e degree granting institution. | |
| 900 | |a RH-HA-ZA | ||
| 596 | |a 1 7 | ||
| 999 | |a TJ7 UMP 2013 SHN |w LC |c 1 |i A516149388 |d 7/5/2015 |f 7/5/2015 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 7/5/2015 | ||
| 999 | |a TJ7 UMP 2013 SHN |w LC |c 2 |i A516164306 |d 7/5/2015 |f 7/5/2015 |g 1 |l COUNTER |m P07JURUTER |r N |s Y |t CD |u 7/5/2015 | ||
| 999 | |a TJ7 UMP 2013 SHN |w LC |c 1 |i A515706270 |d 25/8/2015 |f 25/8/2015 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 14/8/2015 |1 STEM | ||