Mechanical, thermal and microstructural properties of the low-Ag-content Sn-1Ag-0.5Cu solder alloy bearing Fe or A1 for electronics applications /

Mechanical, thermal and microstructural properties of the low-Ag-content Sn-1Ag-0.5Cu solder alloy bearing Fe or A1 for electronics applications /

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書目詳細資料
主要作者:	Shnawah, Dhafer Abdul-Ameer
格式:	Thesis 圖書
語言:	English
出版:	2013
主題:	Alloys > Microstructure. Alloys > Thermal properties. Microstructure.
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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