Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
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| 格式: | Thesis 图书 |
| 语言: | English |
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| 实物描述: | xix, 116 leaves, 13 unnumbered leaves : illustrations ; 30 cm |
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| 参考书目: | Bibliography: leaves 109-114 |