Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
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| Format: | Thesis Book |
| Language: | English |
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| LEADER | 01300cam a2200313 i 4500 | ||
|---|---|---|---|
| 001 | u999192 | ||
| 003 | SIRSI | ||
| 005 | 201407140912 | ||
| 008 | 140714s2010 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ |e rda | ||
| 090 | |a TS176 |b UMP 2010 Dha | ||
| 097 | |a TS176 |b UMP 2010 Gus | ||
| 100 | 1 | |a Dharma, I Gusti Bagus Budi, |e author | |
| 245 | 1 | 0 | |a Solderability of Sn-Cu-based lead-free solder with low content of silver and indium / |c I Gusti Bagus Budi Dharma |
| 264 | 1 | |c 2010 | |
| 264 | 4 | |c 2010 | |
| 300 | |a xix, 116 leaves, 13 unnumbered leaves : |b illustrations ; |c 30 cm | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |b Ph.D |c Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan, Universiti Malaya |d 2010. | ||
| 504 | |a Bibliography: leaves 109-114 | ||
| 650 | 0 | |a Solder and soldering. | |
| 650 | 0 | |a Alloys |x Specifications. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Rekabentuk dan Pembuatan, |e degree granting institution. | |
| 900 | |a MZAR-ZA | ||
| 596 | |a 1 7 | ||
| 999 | |a TS176 UMP 2010 DHA |w LC |c 1 |i A513413446 |d 3/2/2016 |f 3/2/2016 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 22/1/2016 |1 STEM | ||
| 999 | |a TS176 UMP 2010 GUS |w LC |c 1 |i A513413168 |d 12/9/2014 |f 12/9/2014 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 2/9/2014 | ||