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  1. 1
    Electric field emissions of FPGA chip based on gigahertz transverse electromagnetic cell modeling and measurements
    by Chua, King Lee
    Published 2016
    “... measurements. This research study also attempted analysis of the overall GTEM cell performance using...”
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  2. 2
    The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
    by Chua, King Lee
    Published 2004
    “... of the silicon lead-frame interface using ECA die attach materials, and to evaluate the factors contributing...”
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  3. 3
    Electric field emissions of FPGA chip based on gigahertz transverse electromagnetic cell modeling and measurements
    by Chua, King Lee
    Published 2016
    “... measurements. This research study also attempted analysis of the overall GTEM cell performance using...”
    Get full text
    Get full text
    Get full text
    Thesis
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    Saved in:
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