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  1. 1
    Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
    “... Composite Design (CCD) and Box-Behnken Matrix Design method are used to isolate the most important factors...”
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  2. 2
    Temperature cycling test for a Ball Grid Array (BGA) package using finite element analysis (FEA)
    “... design methods namely, Central Composite Design (CCD) and Box-Behnken Matrix Design method are used...”
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