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  1. 1
    A novel method of brazing Cu/Cu-7.0Ni-9.3Sn-6.5P/Cu using microwave hybrid heating /
    by Maisarah Lutfi
    Published 2021
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  2. 2
    Mechanical and microstructure analysis of copper to copper foam brazing using copper-tin-nickel-phosphorus amorphous filler alloys /
    by Nur Amirah Mohd Zahri
    Published 2021
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  3. 3
    Effect of heating on bonding characteristics for copper wire bond technology /
    by Gurbinder Singh Gurmukh Singh
    Published 2021
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  4. 4
    Microstructure and mechanical properties of porous copper and copper brazed with cu-based filler metal /
    by Sami, Mian Muhammad
    Published 2021
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  5. 5
    Mixed micelles of surface active copper (II) amine complexes with some common surfactants /
    by Lim, Kien Heng
    Published 1997
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  6. 6
    Micellar and catalytic properties of some surface-active copper (II) complexes /
    by Tan, Eric Hock Lye
    Published 1992
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  7. 7
    Biosorption of cadmium and copper by the biomass of Sargussum baccularia (Phaeophyta) /
    by Samuel, Vijayalakshmi Benjamin
    Published 1996
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  8. 8
    Biosorption of Cu (II) ions onto base treated sugarcane bagasse /
    by Siti Raihan Zakaria
    Published 2010
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  9. 9
    The effect of copper particle addition into Sn-3.5Ag solder /
    by Aemi Nadia Ahmad Sauffi
    Published 2011
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  10. 10
    Synthesis and structural studies of copper (II) and manganese (III) complexes of 2 - (salicylaldimino) phenol /
    by Inba Raja Ramasamy
    Published 2011
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  11. 11
    Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
    by Chew, Chee Sean
    Published 2011
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  12. 12
    Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
    by Azida Azmi
    Published 2012
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  13. 13
    Assessment of copper conductor thermal conductivity performances for copper access powering /
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  14. 14
    Copper (II) Carboxylate-cyclam complexes as thermally stable magnetic materials /
    by Nur Syamimi Ahmad Tajidi
    Published 2014
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  15. 15
    Brazing of porous copper with copper substrate by using CU-7NI-9.3SN-6.3P as a filler /
    by Fauziah Mohamed Roshidi
    Published 2014
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  16. 16
    Copper(II), nickel(II), and iron(II) complexes of conjugated organic ligands as potential dye-sensitised solar cell materials /
    by Anita Marlina
    Published 2015
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  17. 17
    Structural, magnetic, thermal, mesomorphic and density functional theoretical studies of complexes of copper(II) and iron(II) with carboxylate ions and 2,2'-bipyridine ligands /
    by Lailatun Nazirah Ozair
    Published 2016
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  18. 18
    Biosorption of Copper (II) and Nickel (II) from industrial waste water using Phylanthus Niruri Sp. and Azadirachta Indica Sp. /
    by Nor Aliaa Sedek Shah
    Published 2016
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  19. 19
    Performance evaluation of copper brazing using CU-NI-Sn-P filler metal /
    by Mohd Zubir Md Idris
    Published 2017
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  20. 20
    Kinetic growth of copper oxidation in semiconductor packaging /
    by Siti Rahmah Esa
    Published 2017
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