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Showing 1 - 4 results of 4 for search '"Packaging"', 查询时间: 0.01s Refine Results
  1. 1
    Hygrothermally-induced delamination and cracking in plastic IC packages /
    由 Lin, Tingyu
    出版 1999
    主题: “...Plastics in packaging Fracture...”
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  2. 2
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    由 Prakash Babu Balakrishnan
    出版 2012
    主题: “...Electronic packaging Materials....”
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  3. 3
    Study of compression behaviour and mechanical properties of paper pulp packaging using FEA /
    由 Munirati Ahmad
    出版 2012
    主题: “...Wood-pulp Packaging....”
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  4. 4
    Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
    由 Azida Azmi
    出版 2012
    主题: “...Electronic packaging Materials....”
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