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Electronic packaging
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Microelectronic packaging
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Materials
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Packaging
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Wire bonding (Electronic packaging)
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Package goods industry
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Semiconductors
6
Plastics in packaging
5
Solder and soldering
5
Design and construction
4
Food
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Reliability
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Testing
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Dissertations
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Fracture
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Case studies
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Copper
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Curing
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Design
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Dissertations, Academic
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Epoxy resins
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Integrated circuits
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Organizational change
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Safety measures
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Sintering
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Aerated package treatment systems
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Ball grid array technology
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Biological treatment
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Bread
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6by Suprammaniam, SugumarSubjects: “...Microelectronic packaging. Materials....”
Published 1997
Thesis Book -
7Subjects: “...Wire bonding (Electronic packaging)...”
Thesis Book -
8by Intan Mastura SaadonSubjects: “...Wire bonding (Electronic packaging)....”
Published 2012
Thesis Book -
9by Teoh, Cheng LockSubjects: “...Wire bonding (Electronic packaging) Production control....”
Published 2012
Thesis Book -
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13by Revathi AruchunanSubjects: “...Food Packaging Malaysia Design....”
Published 2019
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Thesis Book -
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18by Prakash Babu BalakrishnanSubjects: “...Electronic packaging Materials....”
Published 2012
Thesis Book -
19Subjects: “...Food Packaging....”
Thesis Book -
20by Low, Pui LengSubjects: “...Microelectronic packaging Materials....”
Published 2020
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Thesis Book