Showing
1 - 1
results of
1
for search '
'
Skip to content
Language
English
中文(简体)
中文(繁體)
اللغة العربية
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
Reset Filters
Collection:
Catalog
Suggested Topics:
4 filters
Design and construction
AND
Electronic packaging
AND
Epoxy resins
AND
Integrated circuits
Reset Filters
Show filters (5)
Collection:
Catalog
Suggested Topics:
4 filters
Design and construction
AND
Electronic packaging
AND
Epoxy resins
AND
Integrated circuits
Search Results
Suggested Topics within your search.
Suggested Topics within your search.
Design and construction
Electronic packaging
Epoxy resins
Integrated circuits
Materials
1
Semiconductor industry
1
Showing
1 - 1
results of
1
for search '
'
, query time: 0.01s
Refine Results
Sort
Relevance
Date Descending
Date Ascending
Call Number
Author
Title
1
An analysis of the epoxy molding compound industry /
by
Chin, Neep Hing
Published 1997
Call Number:
Loading...
Located:
Loading...
Thesis
Book
Loading...
Save to List
Saved in:
Search Tools:
Get RSS Feed
—
Email this Search
—
Save Search
Back
Narrow Search
Institution
Universiti Malaya
1
Collection
Catalog
Author
Chin, Neep Hing
1
Language
English
1
PublishDate
From:
To:
Services hosted by the Perpustakaan Sultan Abdul Samad, Universiti Putra Malaysia with Cooperation MySyL Group
Loading...