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  1. 1
    Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor /
    by Mardiana Said
    Published 2022
    Subjects: “...Solder and soldering Design and construction....”
    Thesis Book
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  2. 2
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    by Haque, Ashraful
    Published 2011
    Subjects: “...Solder and soldering....”
    Thesis Book
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