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Showing 1 - 6 results of 6 for search '"Packaging."', query time: 0.01s Refine Results
  1. 1
    Study of the effect of process variation on wire bond process of IC assembly /
    by Intan Mastura Saadon
    Published 2012
    Subjects: “...Wire bonding (Electronic packaging)....”
    Thesis Book
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  2. 2
    Investigation of the quality and reliability of copper interconnects /
    by Koh, Leong Tee
    Published 2000
    Subjects: “...Electronic packaging....”
    Thesis Book
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  3. 3
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    by Prakash Babu Balakrishnan
    Published 2012
    Subjects: “...Electronic packaging Materials....”
    Thesis Book
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  4. 4
    Kinetic growth of copper oxidation in semiconductor packaging /
    by Siti Rahmah Esa
    Published 2017
    Subjects: “...Microelectronic packaging....”
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    Thesis Book
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  5. 5
    The effects of annealing, temperature and humidity on tin whiskers formation /
    by Lee, Hua Xing
    Published 2009
    Subjects: “...Electronic packaging....”
    Thesis Book
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  6. 6
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    by Haque, Ashraful
    Published 2011
    Subjects: “...Microelectronic packaging....”
    Thesis Book
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