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Showing 21 - 40 results of 53 for search '"Packaging."', query time: 0.02s Refine Results
  1. 21
    Effect of Libyan marinade and vaccum packaging on quality parameters of Tilapia (Oreochromus niloticus) and Yellowstripe scad (Selaroides leptolepis) fillets during storage /
    Subjects: “...Food Packaging....”
    Thesis Book
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  2. 22
    Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
    by Low, Pui Leng
    Published 2020
    Subjects: “...Microelectronic packaging Materials....”
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  3. 23
    Pembangunan pakej perisian galakan literasi : pendekatan multimedia /
    Subjects: “...Software packaging...”
    Thesis Microfilm
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  4. 24
    Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire /
    by Mohd Firdaus Manap
    Published 2017
    Subjects: “...Wire bonding (Electronic packaging)...”
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  5. 25
    Kinetic growth of copper oxidation in semiconductor packaging /
    by Siti Rahmah Esa
    Published 2017
    Subjects: “...Microelectronic packaging....”
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  6. 26
    The effects of annealing, temperature and humidity on tin whiskers formation /
    by Lee, Hua Xing
    Published 2009
    Subjects: “...Electronic packaging....”
    Thesis Book
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  7. 27
    Brand identity in packaging design (BOH Tea)
    Subjects: “...Packaging -- Design...”
    Thesis Book
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  8. 28
    Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
    by Tolentino, Erik Nino
    Published 2020
    Subjects: “...Microelectronic packaging....”
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  9. 29
    Optimization of gel dispensing process in pressure sensor assembly /
    by Shukri Nizam Mohamed Radzi
    Published 2010
    Subjects: “...Wire bonding (Electronic packaging)....”
    Thesis Book
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  10. 30
    Development of non-post mold cure alternative for semiconductor packaging /
    by Tan, Sook Wai
    Published 1997
    Subjects: “...Microelectronic packaging....”
    Thesis Book
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  11. 31
    Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
    by Tay, See Leng
    Published 2011
    Subjects: “...Electronic packaging Materials....”
    Thesis Book
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  12. 32
    Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
    by Wakeel, Saif
    Published 2021
    Subjects: “...Electronic packaging Materials....”
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  13. 33
    An analysis of the epoxy molding compound industry /
    by Chin, Neep Hing
    Published 1997
    Subjects: “...Electronic packaging Materials...”
    Thesis Book
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  14. 34
    Sensor pH optik daripada bahan boleh dimakan sebagai penunjuk kesegaran makanan berbungkus /
    Subjects: “...Food Packaging....”
    Thesis Book
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  15. 35
    Aruhan toleransi sejuk buah betik melalui perlakuan kejut haba dan kesannya ke atas biosintesis etilena /
    by Nor Hanin Ayub
    Published 2007
    Subjects: “...Papaya Packaging...”
    Thesis Book
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  16. 36
    Development of a plastic packaging waste reduction model for Malaysia using hierarchical approach /
    by Liew, Kar Yin
    Published 2017
    Subjects: “...Packaging....”
    Thesis Book
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  17. 37
    Study of compression behaviour and mechanical properties of paper pulp packaging using FEA /
    by Munirati Ahmad
    Published 2012
    Subjects: “...Wood-pulp Packaging....”
    Thesis Book
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  18. 38
    Structural analysis of flexible packaging industry in Malaysia /
    by Lim, Bee Leong
    Published 1995
    Subjects: “...Package goods industry Malaysia....”
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  19. 39
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    by Haque, Ashraful
    Published 2011
    Subjects: “...Microelectronic packaging....”
    Thesis Book
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  20. 40
    Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
    by Azida Azmi
    Published 2012
    Subjects: “...Electronic packaging Materials....”
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