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Showing 21 - 34 results of 34 for search '"Solders"', query time: 0.02s Refine Results
  1. 21
    Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
    by Tolentino, Erik Nino
    Published 2020
    Subjects: “...Solder and soldering....”
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  2. 22
    Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
    by Chew, Chee Sean
    Published 2011
    Subjects: “...Solder and soldering....”
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  3. 23
    Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag-0.5Cu solder alloys bearing Fe and Bi /
    by Mahdavifard, Mohammad Hossein
    Published 2017
    Subjects: “...Solder and soldering....”
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  4. 24
    Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
    by Tay, See Leng
    Published 2011
    Subjects: “...Solder and soldering Materials....”
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  5. 25
    The effect of copper particle addition into Sn-3.5Ag solder /
    by Aemi Nadia Ahmad Sauffi
    Published 2011
    Subjects: “...Solder and soldering....”
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  6. 26
    Effects of molybdenum nanoparticles on lead-free tin-based solder /
    Subjects: “...Solder and soldering....”
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  7. 27
    Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
    by Wakeel, Saif
    Published 2021
    Subjects: “...Solder and soldering....”
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  8. 28
    Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys /
    by Loh, Hwei Ling
    Published 2019
    Subjects: “...Solder and soldering....”
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  9. 29
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    by Haque, Ashraful
    Published 2011
    Subjects: “...Solder and soldering....”
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  10. 30
    Effects of Zn and A1 on corrosion characteristics of Sn-1.0Ag-0.5Cu alloys /
    by Nurul Liyana Kamaruzaman
    Published 2018
    Subjects: “...Solder and soldering Corrosion fatigue....”
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  11. 31
    Evolusi mikrostruktur aloi pateri bebas plumbum akibat tindakan terma dan elektrik /
    by Norainiza Saud
    Published 2011
    Subjects: “...Solder and soldering....”
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  12. 32
    Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /
    by Ibrahim Ahmad
    Published 2007
    Subjects: “...Solder and soldering...”
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  13. 33
    Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /
    Subjects: “...Solder and soldering...”
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  14. 34
    Kesan penambahan unsur P & Ni terhadap sifat migrasi elektrokimia pes aloi pateri berasaskan SAC /
    Subjects: “...Solder pastes....”
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