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Granting Institution:
Universiti Malaya.
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Microstructure
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Solder and soldering
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Thermal properties
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Granting Institution:
Universiti Malaya.
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English
Suggested Topics:
Microstructure
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Solder and soldering
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Thermal properties
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Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag-0.5Cu solder alloys bearing Fe and Bi /
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Mahdavifard, Mohammad Hossein
Published 2017
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Mahdavifard, Mohammad Hossein
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