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  1. 1
    Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys /
    by Loh, Hwei Ling
    Published 2019
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  2. 2
    Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
    by Tolentino, Erik Nino
    Published 2020
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  3. 3
    Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /
    by Leong, Yee Mei
    Published 2020
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  4. 4
    Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
    by Wakeel, Saif
    Published 2021
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  5. 5
    Material characterization of soft solder die attaches for power ICs /
    by Wee, Seng Kee
    Published 1996
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  6. 6
    Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
    by Tay, See Leng
    Published 2011
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  7. 7
    The effect of copper particle addition into Sn-3.5Ag solder /
    by Aemi Nadia Ahmad Sauffi
    Published 2011
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  8. 8
    Wetting behaviors of lead based solders on various substrates at different temperatures /
    by Shaiful Anwar Ismail
    Published 2010
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  9. 9
    Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
    by Chew, Chee Sean
    Published 2011
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  10. 10
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    by Haque, Ashraful
    Published 2011
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  11. 11
    Effects of molybdenum nanoparticles on lead-free tin-based solder /
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  12. 12
    Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
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  13. 13
    Analysis of selected lead-free solders by optical emission spectroscopy /
    by Yee, Chung Lee
    Published 2014
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  14. 14
    Electrodeposition and characterization of SN-BI lead-free soldier alloys /
    by Goh, Ying Xin
    Published 2015
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  15. 15
    Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate /
    by Ghosh, Sujan Kumer
    Published 2015
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  16. 16
    The electrical properties of element-added (FE, AL) lead-free solder alloys : experimental and materials modeling approaches /
    by Nur'aishah Aminah Mohd Amin
    Published 2015
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  17. 17
    Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer /
    by Jannatun Adzura Adnan
    Published 2015
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  18. 18
    Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag-0.5Cu solder alloys bearing Fe and Bi /
    by Mahdavifard, Mohammad Hossein
    Published 2017
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  19. 19
    Evaluation of corrosive environment impact on low cost fe/A1 added SAC105 solder alloys /
    by Nor Ilyana Muhd Nordin
    Published 2017
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  20. 20
    Ultrasonic assisted reflow soldering of lead free solder joint /
    by Tan, Ai Ting
    Published 2017
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