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  1. 1
    Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
    by Low, Pui Leng
    Published 2020
    Subjects: “...Microelectronic packaging Materials....”
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    Thesis Book
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  2. 2
    Development of non-post mold cure alternative for semiconductor packaging /
    by Tan, Sook Wai
    Published 1997
    Subjects: “...Microelectronic packaging....”
    Thesis Book
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