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Showing 1 - 20 results of 30 for search '"Packaging."', query time: 0.02s Refine Results
  1. 1
    Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /
    by Shutesh Krishnan
    Published 2007
    Subjects: “...Microelectronic packaging....”
    Thesis Book
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  2. 2
    Investigation of mechanical properties of paper-based packaging materials /
    by Masni-Azian Akiah
    Published 2011
    Subjects: “...Paper Packaging Materials....”
    Thesis Book
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  3. 3
    Study of alternative packaging materials for semiconductor devices /
    by Suprammaniam, Sugumar
    Published 1997
    Subjects: “...Microelectronic packaging. Materials....”
    Thesis Book
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  4. 4
    First bonding parameter optimization in wire bonding process /
    Subjects: “...Wire bonding (Electronic packaging)...”
    Thesis Book
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  5. 5
    Study of the effect of process variation on wire bond process of IC assembly /
    by Intan Mastura Saadon
    Published 2012
    Subjects: “...Wire bonding (Electronic packaging)....”
    Thesis Book
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  6. 6
    Optimization and reliability of wirebond looping profile for broken neck failure /
    by Teoh, Cheng Lock
    Published 2012
    Subjects: “...Wire bonding (Electronic packaging) Production control....”
    Thesis Book
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  7. 7
    Study of improvement in wire bonding process through critical parameters analysis /
    by Ong, Siew Kee
    Published 2011
    Subjects: “...Wire bonding (Electronic packaging)....”
    Thesis Book
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  8. 8
    Colour versus flavour in the choice of bread packaging design among children at Taman Asuhan & Didikan Kanak-Kanak University Malaya (TADIKUM) Kuala Lumpur /
    by Revathi Aruchunan
    Published 2019
    Subjects: “...Food Packaging Malaysia Design....”
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    Thesis Book
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  9. 9
    Material characterization of soft solder die attaches for power ICs /
    by Wee, Seng Kee
    Published 1996
    Subjects: “...Microelectronic packaging. Materials....”
    Thesis Book
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  10. 10
    The effect of microstructural properties of bonding wires on performance of wirebond interconnect /
    by Ghazali Omar
    Published 2005
    Subjects: “...Wire bonding (Electronic packaging)...”
    Thesis Book
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  11. 11
    Improvement on the ball attach process of BGA packages /
    by Thiaga Rajan Muthusamy
    Published 1999
    Subjects: “...Microelectronic packaging...”
    Thesis Book
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  12. 12
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    by Prakash Babu Balakrishnan
    Published 2012
    Subjects: “...Electronic packaging Materials....”
    Thesis Book
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  13. 13
    Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
    by Low, Pui Leng
    Published 2020
    Subjects: “...Microelectronic packaging Materials....”
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    Thesis Book
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  14. 14
    Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire /
    by Mohd Firdaus Manap
    Published 2017
    Subjects: “...Wire bonding (Electronic packaging)...”
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  15. 15
    Kinetic growth of copper oxidation in semiconductor packaging /
    by Siti Rahmah Esa
    Published 2017
    Subjects: “...Microelectronic packaging....”
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  16. 16
    The effects of annealing, temperature and humidity on tin whiskers formation /
    by Lee, Hua Xing
    Published 2009
    Subjects: “...Electronic packaging....”
    Thesis Book
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  17. 17
    Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
    by Tolentino, Erik Nino
    Published 2020
    Subjects: “...Microelectronic packaging....”
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  18. 18
    Optimization of gel dispensing process in pressure sensor assembly /
    by Shukri Nizam Mohamed Radzi
    Published 2010
    Subjects: “...Wire bonding (Electronic packaging)....”
    Thesis Book
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  19. 19
    Development of non-post mold cure alternative for semiconductor packaging /
    by Tan, Sook Wai
    Published 1997
    Subjects: “...Microelectronic packaging....”
    Thesis Book
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  20. 20
    Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
    by Tay, See Leng
    Published 2011
    Subjects: “...Electronic packaging Materials....”
    Thesis Book
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