Suggested Topics within your search.
Showing 1 - 2 results of 2 for search '"Packaging"', query time: 0.01s Refine Results
  1. 1
    Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /
    by Mohamad Firdaus Rosle
    Published 2010
    Subjects: “...Wire bonding (Electronic packaging)...”
    Thesis Book
    Save to List
    Saved in:
  2. 2
    Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /
    by Saidatul Azura Radzi
    Published 2011
    Subjects: “...Wire bonding (Electronic packaging)....”
    Thesis Book
    Save to List
    Saved in:
Search Tools: Get RSS Feed — Email this Search — Save Search