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  1. 1
    Semiconductor equipment jam rate improvement by using computational fluid dynamics /
    by Chee, Wai Koon
    Published 2010
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  2. 2
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    by Haque, Ashraful
    Published 2011
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  3. 3
    Vision-assisted path planning system for die sorting in semiconductor industry /
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  4. 4
    Kinetic growth of copper oxidation in semiconductor packaging /
    by Siti Rahmah Esa
    Published 2017
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  5. 5
    Device characterization based on stressor, geometric and process design considerations of FET technology /
    by Nurul Aida Farhana Othman
    Published 2018
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  6. 6
    Design and construction of charge pumping technique for MOS transistor characterization /
    by Lee, Hock Guan
    Published 2004
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  7. 7
    Effect of lot size on cycle time for semiconductor back-end manufacturing : a simulation approach /
    by Tong, Douglas Kum Tien
    Published 2006
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  8. 8
    Fillet height failure on low K PBGA packages /
    by Vittal Raja Manikam
    Published 2008
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