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Universiti Malaya
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Electronic packaging
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Wire bonding (Electronic packaging)
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Institution:
Universiti Malaya
Suggested Topics:
Electronic packaging
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Wire bonding (Electronic packaging)
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Wire bonding (Electronic packaging)
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Study of the effect of process variation on wire bond process of IC assembly /
by
Intan Mastura Saadon
Published 2012
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First bonding parameter optimization in wire bonding process /
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Syila Izawana Ismail
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Study of improvement in wire bonding process through critical parameters analysis /
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Ong, Siew Kee
Published 2011
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Optimization and reliability of wirebond looping profile for broken neck failure /
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Teoh, Cheng Lock
Published 2012
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Institution
Universiti Malaya
Collection
Catalog
4
Author
Intan Mastura Saadon
1
Ong, Siew Kee
1
Syila Izawana Ismail
1
Teoh, Cheng Lock
1
Granting Institution
Universiti Malaya.
4
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