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  1. 1
    Spreading resistance correction factor calculations /
    by Tan, Leng Seow
    Published 1980
    Thesis Book
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  2. 2
    A spectroscopic photoemission microscopy system for semiconductor device analysis /
    by Koh, Lian-Ser
    Published 1994
    Thesis Book
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  3. 3
    Reliability of wire bonding in micro electronic packaging /
    by Ghazali Omar
    Published 1996
    Thesis Book
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  4. 4
    Statistical analysis of wire-bond pull strength and accelerated stress-testing study /
    by Liu, Hao
    Published 1997
    Thesis Book
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  5. 5
    An investigation into the electron beam induced current effects on semiconductor materials and devices /
    by Ong, Vincent Keng Sian
    Published 1995
    Thesis Book
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  6. 6
    Optical absorption studies of heavily doped silicon /
    by Aw, Siew Eng
    Published 1986
    Thesis Book
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  7. 7
    Ultra shallow secondary ion mass spectrometric studies on semiconductors /
    by Ng, Chee Mang
    Published 2001
    Thesis Book
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  8. 8
    Study on the conversion of wire material from gold to copper in semiconductor ball grid packaging /
    by Ronald Reegan Raipen
    Published 2012
    Thesis Book
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  9. 9
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    by Prakash Babu Balakrishnan
    Published 2012
    Thesis Book
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