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Showing 1 - 12 results of 12 for search '"Packaging materials"', 查询时间: 0.02s Refine Results
  1. 1
    Investigation of mechanical properties of paper-based packaging materials /
    由 Masni-Azian Akiah
    出版 2011
    主题: “...Paper Packaging Materials....”
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  2. 2
    Material characterization of soft solder die attaches for power ICs /
    由 Wee, Seng Kee
    出版 1996
    主题: “...Microelectronic packaging. Materials....”
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  3. 3
    Potential of local k-carrageenan extracted from red seaweed (Eucheuma cottonii) as food packaging material
    由 Abdul Muttalib, Ili Balqis
    出版 2018
    主题: “...Food - Packaging - Materials...”
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  4. 4
    Study of alternative packaging materials for semiconductor devices /
    由 Suprammaniam, Sugumar
    出版 1997
    主题: “...Microelectronic packaging. Materials....”
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  5. 5
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    由 Prakash Babu Balakrishnan
    出版 2012
    主题: “...Electronic packaging Materials....”
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  6. 6
    Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
    由 Low, Pui Leng
    出版 2020
    主题: “...Microelectronic packaging Materials....”
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  7. 7
    Active paper coating based on fish gelatin, palm wax and lemongrass essential oil for ground beef packaging application
    由 Sahid, Nurul Syahida
    出版 2020
    主题: “...Packaging materials...”
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  8. 8
    A study of wire sweep during transfer molding on plastic IC packaging /
    由 Wu, Jianhua
    出版 1996
    主题: “...Electronic packaging Materials...”
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  9. 9
    Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
    由 Tay, See Leng
    出版 2011
    主题: “...Electronic packaging Materials....”
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  10. 10
    Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
    由 Wakeel, Saif
    出版 2021
    主题: “...Electronic packaging Materials....”
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  11. 11
    An analysis of the epoxy molding compound industry /
    由 Chin, Neep Hing
    出版 1997
    主题: “...Electronic packaging Materials...”
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  12. 12
    Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
    由 Azida Azmi
    出版 2012
    主题: “...Electronic packaging Materials....”
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