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  1. 1
    A novel method of brazing Cu/Cu-7.0Ni-9.3Sn-6.5P/Cu using microwave hybrid heating /
    by Maisarah Lutfi
    Published 2021
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  2. 2
    Mechanical and microstructure analysis of copper to copper foam brazing using copper-tin-nickel-phosphorus amorphous filler alloys /
    by Nur Amirah Mohd Zahri
    Published 2021
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  3. 3
    Effect of heating on bonding characteristics for copper wire bond technology /
    by Gurbinder Singh Gurmukh Singh
    Published 2021
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  4. 4
    Microstructure and mechanical properties of porous copper and copper brazed with cu-based filler metal /
    by Sami, Mian Muhammad
    Published 2021
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  5. 5
    Cavitation and dynamic grain growth during hot tensile test in copper /
    by Lu, Peter Hong Hwa
    Published 1991
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  6. 6
    Void interaction during ductile fracture /
    by Tan, Joo Lett
    Published 1992
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  7. 7
    Creep cavitation in copper at high temperature /
    by Pak, Hoe Peng
    Published 1994
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  8. 8
    Mixed micelles of surface active copper (II) amine complexes with some common surfactants /
    by Lim, Kien Heng
    Published 1997
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  9. 9
    Micellar and catalytic properties of some surface-active copper (II) complexes /
    by Tan, Eric Hock Lye
    Published 1992
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  10. 10
    Biosorption of cadmium and copper by the biomass of Sargussum baccularia (Phaeophyta) /
    by Samuel, Vijayalakshmi Benjamin
    Published 1996
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  11. 11
    Environmental corrosion of copper and its protection /
    by Feng, Yiqi
    Published 1997
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  12. 12
    Biosorption of Cu (II) ions onto base treated sugarcane bagasse /
    by Siti Raihan Zakaria
    Published 2010
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  13. 13
    The effect of copper particle addition into Sn-3.5Ag solder /
    by Aemi Nadia Ahmad Sauffi
    Published 2011
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  14. 14
    Synthesis and structural studies of copper (II) and manganese (III) complexes of 2 - (salicylaldimino) phenol /
    by Inba Raja Ramasamy
    Published 2011
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  15. 15
    Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
    by Chew, Chee Sean
    Published 2011
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  16. 16
    Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
    by Azida Azmi
    Published 2012
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  17. 17
    Grain boundary energies in copper /
    by Ramli Omar
    Published 1987
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  18. 18
    Self consistent electronic structure of copper thin films /
    by Euceda, Armando
    Published 1983
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  19. 19
    Kajian penspesiesan dan penentuan ketoksikan logam aluminium, kuprum dan zink dalam larutan akueus /
    by Erdawati
    Published 1997
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  20. 20
    The kinetics of copper desorption from soil and selected clays /
    by Marcus Jopony
    Published 1984
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