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  1. 1
    Kinetic growth of copper oxidation in semiconductor packaging /
    by Siti Rahmah Esa
    Published 2017
    Subjects: “...Microelectronic packaging....”
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    Thesis Book
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  2. 2
    Optimization of gel dispensing process in pressure sensor assembly /
    by Shukri Nizam Mohamed Radzi
    Published 2010
    Subjects: “...Wire bonding (Electronic packaging)....”
    Thesis Book
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  3. 3
    An analysis of the epoxy molding compound industry /
    by Chin, Neep Hing
    Published 1997
    Subjects: “...Electronic packaging Materials...”
    Thesis Book
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  4. 4
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    by Haque, Ashraful
    Published 2011
    Subjects: “...Microelectronic packaging....”
    Thesis Book
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