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  1. 1
    Fabrikasi sensor tekanan kapasitif sangat rendah (STKSR) menggunakan teknologi proses piawai CMOS /
    by Muhammad Ramdzan Buyong
    Published 2010
    Subjects: “...Microelectronics....”
    Thesis Book
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  2. 2
    A study of wire bonded Cu-A1 in microelectronics packaging /
    by Tan, Chee Wei
    Published 2002
    Subjects: “...Microelectronic packaging...”
    Thesis Book
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