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  1. 1
    Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
    by Wakeel, Saif
    Published 2021
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  2. 2
    A study of wire sweep during transfer molding on plastic IC packaging /
    by Wu, Jianhua
    Published 1996
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  3. 3
    An analysis of the epoxy molding compound industry /
    by Chin, Neep Hing
    Published 1997
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  4. 4
    Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
    by Tay, See Leng
    Published 2011
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  5. 5
    Study of the effect of process variation on wire bond process of IC assembly /
    by Intan Mastura Saadon
    Published 2012
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  6. 6
    First bonding parameter optimization in wire bonding process /
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  7. 7
    Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
    by Azida Azmi
    Published 2012
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  8. 8
    Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /
    by Zainudin Kornain
    Published 2012
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  9. 9
    Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /
    by Mohamad Firdaus Rosle
    Published 2010
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  10. 10
    Delamination propagation in plastic IC packages during solder reflow /
    by Ma, Yiyi
    Published 1999
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  11. 11
    Investigation of the quality and reliability of copper interconnects /
    by Koh, Leong Tee
    Published 2000
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  12. 12
    The effects of annealing, temperature and humidity on tin whiskers formation /
    by Lee, Hua Xing
    Published 2009
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  13. 13
    Study of improvement in wire bonding process through critical parameters analysis /
    by Ong, Siew Kee
    Published 2011
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  14. 14
    Optimization and reliability of wirebond looping profile for broken neck failure /
    by Teoh, Cheng Lock
    Published 2012
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  15. 15
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    by Prakash Babu Balakrishnan
    Published 2012
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