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  1. 21
    An investigation of thermally induced fracture of glass using high-speed digital imaging /
    by Chin, Yee Loong
    Published 1998
    Thesis Book
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  2. 22
    Hygrothermally-induced delamination and cracking in plastic IC packages /
    by Lin, Tingyu
    Published 1999
    Thesis Book
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  3. 23
    Delamination propagation in plastic IC packages during solder reflow /
    by Ma, Yiyi
    Published 1999
    Thesis Book
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  4. 24
    Fracture analysis of structural components in floating production vessels and ships /
    by Tronskar, Jens P.
    Published 2002
    Thesis Book
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  5. 25
    Production of alumina/zirconia functionally graded material by electrophoretic deposition /
    by Mehrali, Mehdi
    Published 2010
    Thesis Book
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  6. 26
    Effect of cut-out on the buckling behavior of composite plate /
    by Yousef, Mohamed Hamid Elsheikh
    Published 2010
    Thesis Book
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