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  1. 1
    Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys /
    by Loh, Hwei Ling
    Published 2019
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  2. 2
    The effect of copper particle addition into Sn-3.5Ag solder /
    by Aemi Nadia Ahmad Sauffi
    Published 2011
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  3. 3
    Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
    by Chew, Chee Sean
    Published 2011
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  4. 4
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    by Haque, Ashraful
    Published 2011
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  5. 5
    Effects of molybdenum nanoparticles on lead-free tin-based solder /
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  6. 6
    Evolusi mikrostruktur aloi pateri bebas plumbum akibat tindakan terma dan elektrik /
    by Norainiza Saud
    Published 2011
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  7. 7
    Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /
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  8. 8
    Electrodeposition and characterization of SN-BI lead-free soldier alloys /
    by Goh, Ying Xin
    Published 2015
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  9. 9
    Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate /
    by Ghosh, Sujan Kumer
    Published 2015
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  10. 10
    The electrical properties of element-added (FE, AL) lead-free solder alloys : experimental and materials modeling approaches /
    by Nur'aishah Aminah Mohd Amin
    Published 2015
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  11. 11
    Effects of Zn and A1 on corrosion characteristics of Sn-1.0Ag-0.5Cu alloys /
    by Nurul Liyana Kamaruzaman
    Published 2018
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