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Showing 1 - 2 results of 2 for search '"Packaging"', query time: 0.01s Refine Results
  1. 1
    A study of wire sweep during transfer molding on plastic IC packaging /
    by Wu, Jianhua
    Published 1996
    Subjects: “...Integrated circuits Packaging...”
    Thesis Book
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  2. 2
    Investigation of mechanical properties of paper-based packaging materials /
    by Masni-Azian Akiah
    Published 2011
    Subjects: “...Paper Packaging Materials....”
    Thesis Book
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