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  1. 1
    Reliability of wire bonding in micro electronic packaging /
    by Ghazali Omar
    Published 1996
    Thesis Book
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  2. 2
    Statistical analysis of wire-bond pull strength and accelerated stress-testing study /
    by Liu, Hao
    Published 1997
    Thesis Book
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  3. 3
    3D visual inspection of IC bonding wires /
    by Han, Xiao
    Published 1997
    Thesis Book
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  4. 4
    Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /
    by Saidatul Azura Radzi
    Published 2011
    Thesis Book
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  5. 5
    Growth, characterization and gas sensing properties of one dimensional oxide nanostructures on Ti and Ti-6Al-4V alloy substrates synthesized by thermal oxidation /
    by Mahmood, Md. Arafat
    Published 2017
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    Thesis Book
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  6. 6
    A study of the Au-Al wire bonding image using mixture distribution /
    by Liew, Kian Wah
    Published 2004
    Thesis Book
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