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  1. 1
    Reliability of wire bonding in micro electronic packaging /
    by Ghazali Omar
    Published 1996
    Subjects: “...Miniature electronic equipment Bonding Testing....”
    Thesis Book
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  2. 2
    Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /
    by Saidatul Azura Radzi
    Published 2011
    Subjects: “...Wire bonding (Electronic packaging)....”
    Thesis Book
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