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  1. 1
    Package cracking mechanism in plastic encapsulated integrated circuit devices /
    by Tan, Geok Leong
    Published 1993
    Thesis Book
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  2. 2
    Study of alternative packaging materials for semiconductor devices /
    by Suprammaniam, Sugumar
    Published 1997
    Thesis Book
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  3. 3
    Colour versus flavour in the choice of bread packaging design among children at Taman Asuhan & Didikan Kanak-Kanak University Malaya (TADIKUM) Kuala Lumpur /
    by Revathi Aruchunan
    Published 2019
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    Thesis Book
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  4. 4
    Hygrothermally-induced delamination and cracking in plastic IC packages /
    by Lin, Tingyu
    Published 1999
    Thesis Book
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  5. 5
    Delamination propagation in plastic IC packages during solder reflow /
    by Ma, Yiyi
    Published 1999
    Thesis Book
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