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Showing 1 - 7 results of 7 for search '"Electron"', query time: 0.01s Refine Results
  1. 1
    First bonding parameter optimization in wire bonding process /
    Subjects: “...Wire bonding (Electronic packaging)...”
    Thesis Book
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  2. 2
    Study of the effect of process variation on wire bond process of IC assembly /
    by Intan Mastura Saadon
    Published 2012
    Subjects: “...Wire bonding (Electronic packaging)....”
    Thesis Book
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  3. 3
    Optimization and reliability of wirebond looping profile for broken neck failure /
    by Teoh, Cheng Lock
    Published 2012
    Subjects: “...Wire bonding (Electronic packaging) Production control....”
    Thesis Book
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  4. 4
    Study of improvement in wire bonding process through critical parameters analysis /
    by Ong, Siew Kee
    Published 2011
    Subjects: “...Wire bonding (Electronic packaging)....”
    Thesis Book
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  5. 5
    Harmonic analysis and mitigation of electronic devices using passive filter /
    by Hashbullishman Hashim
    Published 2005
    Subjects: “...Electronic apparatus and appliances Reliability....”
    Thesis Book
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  6. 6
    Parametric yield enhancement of electronic circuits /
    by Wu, Ting
    Published 1999
    Subjects: “...Electronic circuits....”
    Thesis Book
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  7. 7
    On agreement and knowledge in a faulty network /
    by Tan, King Yang
    Published 1991
    Subjects: “...Electronic data processing Distributed processing....”
    Thesis Book
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