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  1. 1
    Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices /
    by Mohd. Salleh Ismail
    Published 1993
    Subjects: “...Integrated circuits Water scale integration....”
    Thesis Book
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  2. 2
    Keboleharapan pakej skala wafer (WSP) menggunakan teknologi pengendapan nikel tanpa elektrik rendaman emas (ENIG) metalurgi bonggol bawahan (UBM) /
    by Siti Hajar Abdullah
    Published 2007
    Subjects: “...Integrated circuits Wafer scale integration...”
    Thesis Book
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