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  1. 1
    Effects of molybdenum nanoparticles on lead-free tin-based solder /
    Subjects: “...Lead-free electronics manufacturing processes....”
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  2. 2
    Analysis of selected lead-free solders by optical emission spectroscopy /
    by Yee, Chung Lee
    Published 2014
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  3. 3
    Electrodeposition and characterization of SN-BI lead-free soldier alloys /
    by Goh, Ying Xin
    Published 2015
    Subjects: “...Lead-free electronics manufacturing processes...”
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  4. 4
    Ultrasonic assisted reflow soldering of lead free solder joint /
    by Tan, Ai Ting
    Published 2017
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  5. 5
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    by Haque, Ashraful
    Published 2011
    Subjects: “...Lead-free electronics manufacturing processes....”
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  6. 6
    The electrical properties of element-added (FE, AL) lead-free solder alloys : experimental and materials modeling approaches /
    by Nur'aishah Aminah Mohd Amin
    Published 2015
    Subjects: “...Lead-free electronics manufacturing processes....”
    Thesis Book
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  7. 7
    Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer /
    by Jannatun Adzura Adnan
    Published 2015
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  8. 8
    Effects of molybdenum nanoparticles on the interface between lead-free solder and nickel substrate /
    by Mahdavifard, Mohammad Hossein
    Published 2013
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  9. 9
    Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
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  10. 10
    Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
    by Chew, Chee Sean
    Published 2011
    Subjects: “...Lead-free electronics manufacturing processes....”
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  11. 11
    Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer /
    by Nashrah Hani Jamadon
    Published 2017
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  12. 12
    Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate /
    by Ghosh, Sujan Kumer
    Published 2015
    Subjects: “...Lead-free electronics manufacturing processes....”
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  13. 13
    The effect of copper particle addition into Sn-3.5Ag solder /
    by Aemi Nadia Ahmad Sauffi
    Published 2011
    Subjects: “...Lead-free electronics manufacturing processes....”
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  14. 14
    Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7Cu lead-free solder alloy /
    by Jaffery, Syed Hassan Abbas
    Published 2017
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  15. 15
    Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys /
    by Loh, Hwei Ling
    Published 2019
    Subjects: “...Lead-free electronics manufacturing processes....”
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  16. 16
    Effects of Zn and A1 on corrosion characteristics of Sn-1.0Ag-0.5Cu alloys /
    by Nurul Liyana Kamaruzaman
    Published 2018
    Subjects: “...Lead-free electronics manufacturing processes....”
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  17. 17
    Evolusi mikrostruktur aloi pateri bebas plumbum akibat tindakan terma dan elektrik /
    by Norainiza Saud
    Published 2011
    Subjects: “...Lead-free electronics manufacturing processes....”
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  18. 18
    Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /
    by Ibrahim Ahmad
    Published 2007
    Subjects: “...Lead free electronics manufacturing processes...”
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  19. 19
    Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /
    Subjects: “...Lead-free electronics manufacturing processes...”
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