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  1. 1
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    by Prakash Babu Balakrishnan
    Published 2012
    Subjects: “...Electronic packaging Materials....”
    Thesis Book
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  2. 2
    Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
    by Azida Azmi
    Published 2012
    Subjects: “...Electronic packaging Materials....”
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    Thesis Book
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