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  1. 1
    Hygrothermally-induced delamination and cracking in plastic IC packages /
    by Lin, Tingyu
    Published 1999
    Subjects: “...Plastics in packaging Fracture...”
    Thesis Book
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  2. 2
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    by Prakash Babu Balakrishnan
    Published 2012
    Subjects: “...Electronic packaging Materials....”
    Thesis Book
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  3. 3
    Study of compression behaviour and mechanical properties of paper pulp packaging using FEA /
    by Munirati Ahmad
    Published 2012
    Subjects: “...Wood-pulp Packaging....”
    Thesis Book
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  4. 4
    Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
    by Azida Azmi
    Published 2012
    Subjects: “...Electronic packaging Materials....”
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    Thesis Book
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