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  1. 1
    Wire sweep characteristics of multi-tier palladium-copper wire bonding on low quad flat package with low alpha green mold compound /
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  2. 2
    Design and fabrication of copper-filled photonic crystal fiber for passive optical devices /
    由 Mohd Fahmi Azman
    出版 2019
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  3. 3
    Moving towards non-destructive testing for wirebond process using EWMA as a real time input process control /
    由 Ghanesh Periasamy
    出版 1997
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  4. 4
    A study of curing process optimisation for manufacturing of polyurethane enamelled copper wire /
    由 Sim, Weng Kee
    出版 2009
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