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Showing 1 - 20 results of 43 for search '"Packaging"', 查询时间: 0.02s Refine Results
  1. 1
    Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /
    由 Shutesh Krishnan
    出版 2007
    主题: “...Microelectronic packaging....”
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  2. 2
    A study of wire sweep during transfer molding on plastic IC packaging /
    由 Wu, Jianhua
    出版 1996
    主题: “...Integrated circuits Packaging...”
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  3. 3
    Investigation of mechanical properties of paper-based packaging materials /
    由 Masni-Azian Akiah
    出版 2011
    主题: “...Paper Packaging Materials....”
    Thesis 图书
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  4. 4
    Package cracking mechanism in plastic encapsulated integrated circuit devices /
    由 Tan, Geok Leong
    出版 1993
    主题: “...Microelectronic packaging....”
    Thesis 图书
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  5. 5
    Delamination propagation in plastic IC packages during solder reflow /
    由 Ma, Yiyi
    出版 1999
    主题: “...Plastics in packaging Fracture...”
    Thesis 图书
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  6. 6
    Study of alternative packaging materials for semiconductor devices /
    由 Suprammaniam, Sugumar
    出版 1997
    主题: “...Microelectronic packaging. Materials....”
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  7. 7
    First bonding parameter optimization in wire bonding process /
    主题: “...Wire bonding (Electronic packaging)...”
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  8. 8
    Study of the effect of process variation on wire bond process of IC assembly /
    由 Intan Mastura Saadon
    出版 2012
    主题: “...Wire bonding (Electronic packaging)....”
    Thesis 图书
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  9. 9
    Optimization and reliability of wirebond looping profile for broken neck failure /
    由 Teoh, Cheng Lock
    出版 2012
    主题: “...Wire bonding (Electronic packaging) Production control....”
    Thesis 图书
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  10. 10
    A study of wire bonded Cu-A1 in microelectronics packaging /
    由 Tan, Chee Wei
    出版 2002
    主题: “...Microelectronic packaging...”
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  11. 11
    Study of improvement in wire bonding process through critical parameters analysis /
    由 Ong, Siew Kee
    出版 2011
    主题: “...Wire bonding (Electronic packaging)....”
    Thesis 图书
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  12. 12
    Investigation of the quality and reliability of copper interconnects /
    由 Koh, Leong Tee
    出版 2000
    主题: “...Electronic packaging....”
    Thesis 图书
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  13. 13
    Colour versus flavour in the choice of bread packaging design among children at Taman Asuhan & Didikan Kanak-Kanak University Malaya (TADIKUM) Kuala Lumpur /
    由 Revathi Aruchunan
    出版 2019
    主题: “...Food Packaging Malaysia Design....”
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  14. 14
    Material characterization of soft solder die attaches for power ICs /
    由 Wee, Seng Kee
    出版 1996
    主题: “...Microelectronic packaging. Materials....”
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  15. 15
    The effect of microstructural properties of bonding wires on performance of wirebond interconnect /
    由 Ghazali Omar
    出版 2005
    主题: “...Wire bonding (Electronic packaging)...”
    Thesis 图书
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  16. 16
    Improvement on the ball attach process of BGA packages /
    由 Thiaga Rajan Muthusamy
    出版 1999
    主题: “...Microelectronic packaging...”
    Thesis 图书
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  17. 17
    Hygrothermally-induced delamination and cracking in plastic IC packages /
    由 Lin, Tingyu
    出版 1999
    主题: “...Plastics in packaging Fracture...”
    Thesis 图书
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  18. 18
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    由 Prakash Babu Balakrishnan
    出版 2012
    主题: “...Electronic packaging Materials....”
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  19. 19
    Effect of Libyan marinade and vaccum packaging on quality parameters of Tilapia (Oreochromus niloticus) and Yellowstripe scad (Selaroides leptolepis) fillets during storage /
    主题: “...Food Packaging....”
    Thesis 图书
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  20. 20
    Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
    由 Low, Pui Leng
    出版 2020
    主题: “...Microelectronic packaging Materials....”
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