在您的搜尋 主題建議
Showing 1 - 7 results of 7 for search '"Packaging"', 查詢時間: 0.01s Refine Results
  1. 1
    First bonding parameter optimization in wire bonding process /
    主題: “...Wire bonding (Electronic packaging)...”
    Thesis 圖書
    加到收藏夾
    Saved in:
  2. 2
    Study of the effect of process variation on wire bond process of IC assembly /
    由 Intan Mastura Saadon
    出版 2012
    主題: “...Wire bonding (Electronic packaging)....”
    Thesis 圖書
    加到收藏夾
    Saved in:
  3. 3
    Optimization and reliability of wirebond looping profile for broken neck failure /
    由 Teoh, Cheng Lock
    出版 2012
    主題: “...Wire bonding (Electronic packaging) Production control....”
    Thesis 圖書
    加到收藏夾
    Saved in:
  4. 4
    Study of improvement in wire bonding process through critical parameters analysis /
    由 Ong, Siew Kee
    出版 2011
    主題: “...Wire bonding (Electronic packaging)....”
    Thesis 圖書
    加到收藏夾
    Saved in:
  5. 5
    The effect of microstructural properties of bonding wires on performance of wirebond interconnect /
    由 Ghazali Omar
    出版 2005
    主題: “...Wire bonding (Electronic packaging)...”
    Thesis 圖書
    加到收藏夾
    Saved in:
  6. 6
    Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire /
    由 Mohd Firdaus Manap
    出版 2017
    主題: “...Wire bonding (Electronic packaging)...”
    獲取全文
    Thesis 圖書
    加到收藏夾
    Saved in:
  7. 7
    Optimization of gel dispensing process in pressure sensor assembly /
    由 Shukri Nizam Mohamed Radzi
    出版 2010
    主題: “...Wire bonding (Electronic packaging)....”
    Thesis 圖書
    加到收藏夾
    Saved in:
檢索工具: 得到RSS訂閱 — 推薦此搜索 — 保存搜索