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  1. 1
    Study of the effect of process variation on wire bond process of IC assembly /
    by Intan Mastura Saadon
    Published 2012
    Thesis Book
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  2. 2
    Investigation of the quality and reliability of copper interconnects /
    by Koh, Leong Tee
    Published 2000
    Thesis Book
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  3. 3
    The effects of annealing, temperature and humidity on tin whiskers formation /
    by Lee, Hua Xing
    Published 2009
    Thesis Book
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  4. 4
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    by Prakash Babu Balakrishnan
    Published 2012
    Thesis Book
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