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  1. 1
    Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys /
    由 Loh, Hwei Ling
    出版 2019
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  2. 2
    Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
    由 Tolentino, Erik Nino
    出版 2020
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  3. 3
    Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /
    由 Leong, Yee Mei
    出版 2020
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  4. 4
    Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
    由 Wakeel, Saif
    出版 2021
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  5. 5
    Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor /
    由 Mardiana Said
    出版 2022
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  6. 6
    Study on solder paste statistical process control (SPC) using vision inspection /
    由 Chan, Gaik Tatt
    出版 1992
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  7. 7
    Material characterization of soft solder die attaches for power ICs /
    由 Wee, Seng Kee
    出版 1996
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  8. 8
    Thermal analysis of IC components undergoing solder reflow /
    由 Chow, Seng Guan
    出版 1996
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  9. 9
    Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
    由 Tay, See Leng
    出版 2011
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  10. 10
    The effect of copper particle addition into Sn-3.5Ag solder /
    由 Aemi Nadia Ahmad Sauffi
    出版 2011
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  11. 11
    Wetting behaviors of lead based solders on various substrates at different temperatures /
    由 Shaiful Anwar Ismail
    出版 2010
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  12. 12
    Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
    由 Chew, Chee Sean
    出版 2011
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  13. 13
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    由 Haque, Ashraful
    出版 2011
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  14. 14
    Effects of molybdenum nanoparticles on lead-free tin-based solder /
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  15. 15
    Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
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  16. 16
    Evolusi mikrostruktur aloi pateri bebas plumbum akibat tindakan terma dan elektrik /
    由 Norainiza Saud
    出版 2011
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  17. 17
    Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /
    由 Ibrahim Ahmad
    出版 2007
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  18. 18
    Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /
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  19. 19
    Analysis of selected lead-free solders by optical emission spectroscopy /
    由 Yee, Chung Lee
    出版 2014
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  20. 20
    Electrodeposition and characterization of SN-BI lead-free soldier alloys /
    由 Goh, Ying Xin
    出版 2015
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