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Showing 1 - 12 results of 12 for search '"Lead"', 查詢時間: 0.02s Refine Results
  1. 1
    Electrodeposition and characterization of SN-BI lead-free soldier alloys /
    由 Goh, Ying Xin
    出版 2015
    主題: “...Lead-free electronics manufacturing processes...”
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  2. 2
    Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate /
    由 Ghosh, Sujan Kumer
    出版 2015
    主題: “...Lead-free electronics manufacturing processes....”
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  3. 3
    The electrical properties of element-added (FE, AL) lead-free solder alloys : experimental and materials modeling approaches /
    由 Nur'aishah Aminah Mohd Amin
    出版 2015
    主題: “...Lead-free electronics manufacturing processes....”
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  4. 4
    Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
    由 Chew, Chee Sean
    出版 2011
    主題: “...Lead-free electronics manufacturing processes....”
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  5. 5
    The effect of copper particle addition into Sn-3.5Ag solder /
    由 Aemi Nadia Ahmad Sauffi
    出版 2011
    主題: “...Lead-free electronics manufacturing processes....”
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  6. 6
    Effects of molybdenum nanoparticles on lead-free tin-based solder /
    主題: “...Lead-free electronics manufacturing processes....”
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  7. 7
    Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys /
    由 Loh, Hwei Ling
    出版 2019
    主題: “...Lead-free electronics manufacturing processes....”
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  8. 8
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    由 Haque, Ashraful
    出版 2011
    主題: “...Lead-free electronics manufacturing processes....”
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  9. 9
    Effects of Zn and A1 on corrosion characteristics of Sn-1.0Ag-0.5Cu alloys /
    由 Nurul Liyana Kamaruzaman
    出版 2018
    主題: “...Lead-free electronics manufacturing processes....”
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  10. 10
    Evolusi mikrostruktur aloi pateri bebas plumbum akibat tindakan terma dan elektrik /
    由 Norainiza Saud
    出版 2011
    主題: “...Lead-free electronics manufacturing processes....”
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  11. 11
    Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /
    由 Ibrahim Ahmad
    出版 2007
    主題: “...Lead free electronics manufacturing processes...”
    Thesis 圖書
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  12. 12
    Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /
    主題: “...Lead-free electronics manufacturing processes...”
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