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    Mechanical, thermal and microstructural properties of the low-Ag-content Sn-1Ag-0.5Cu solder alloy bearing Fe or A1 for electronics applications /
    由 Shnawah, Dhafer Abdul-Ameer
    出版 2013
    主題: “...Alloys Thermal properties....”
    Thesis 圖書
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  2. 2
    Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag-0.5Cu solder alloys bearing Fe and Bi /
    主題: “...Alloys Thermal properties....”
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