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  1. 1
    Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer /
    by Jannatun Adzura Adnan
    Published 2015
    Subjects: “...Electrodiffusion....”
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    Thesis Book
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  2. 2
    A reliability methodology for deep sub-micron interconnect metal liners /
    by Wong, Poh Ling
    Published 2005
    Subjects: “...Electrodiffusion....”
    Thesis Book
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  3. 3
    Electromigration damage in lead-free solder joints prepared using metallic nanoparticle doped flux /
    by Nasir, Muhammad
    Published 2017
    Subjects: “...Electrodiffusion....”
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    Thesis Book
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  4. 4
    The influence of a layer of oxide on electromigration performance of Al/Cu/Si metal lines /
    by Koh, David Khar Ann
    Published 1995
    Subjects: “...Electrodiffusion...”
    Thesis Book
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