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Showing 1 - 20 results of 27 for search '"Electronic packaging"', 查询时间: 0.03s Refine Results
  1. 1
    First bonding parameter optimization in wire bonding process /
    主题: “...Wire bonding (Electronic packaging)...”
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  2. 2
    Study of the effect of process variation on wire bond process of IC assembly /
    由 Intan Mastura Saadon
    出版 2012
    主题: “...Wire bonding (Electronic packaging)....”
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  3. 3
    Optimization and reliability of wirebond looping profile for broken neck failure /
    由 Teoh, Cheng Lock
    出版 2012
    主题: “...Wire bonding (Electronic packaging) Production control....”
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  4. 4
    Study of improvement in wire bonding process through critical parameters analysis /
    由 Ong, Siew Kee
    出版 2011
    主题: “...Wire bonding (Electronic packaging)....”
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  5. 5
    Camera Independent Face Recognition Algorithm In Visual Surveillance
    由 Yew, Chuu Tian
    出版 2015
    主题: “...TK7870 Electronic packaging ...”
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  6. 6
    Highly Efficient Multi-Gigabit Commandstatus Packet Tunneling Technique In Inter-Fpga Packet Streaming Architecture
    由 Loh, Mui Soon
    出版 2016
    主题: “...TK7870 Electronic packaging ...”
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  7. 7
    Investigation of the quality and reliability of copper interconnects /
    由 Koh, Leong Tee
    出版 2000
    主题: “...Electronic packaging....”
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  8. 8
    Validation of Colpitts Vco Design for Two Way Portable Radio Applications
    由 Raj Arul, Aldrin
    出版 2013
    主题: “...TK7870 Electronic packaging ...”
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  9. 9
    Improving the Efficiency of Histogram of Oriented Gradient Feature for Human Detection
    由 Lai, Chi Qin
    出版 2016
    主题: “...TK7870 Electronic packaging ...”
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  10. 10
    Improvement of Underwater Image Contrast Enhancement Technique Based on Histogram Modification
    主题: “...TK7870 Electronic packaging ...”
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  11. 11
    Crash Recovery Support For Variable Strength T-Way Test Generation Strategy
    由 Abdullah, Syahrul Afzal Che
    出版 2016
    主题: “...TK7870 Electronic packaging ...”
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  12. 12
    Delamination propagation in plastic IC packages during solder reflow /
    由 Ma, Yiyi
    出版 1999
    主题: “...Electronic packaging....”
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  13. 13
    The effect of microstructural properties of bonding wires on performance of wirebond interconnect /
    由 Ghazali Omar
    出版 2005
    主题: “...Wire bonding (Electronic packaging)...”
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  14. 14
    Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /
    由 Mohamad Firdaus Rosle
    出版 2010
    主题: “...Wire bonding (Electronic packaging)...”
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  15. 15
    An Expert System for Trouble Shooting - Auto Wire Bonder Machine
    由 Ng, Yu Ting
    出版 1997
    主题: “...Wire bonding (Electronic packaging) - Case studies...”
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  16. 16
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    由 Prakash Babu Balakrishnan
    出版 2012
    主题: “...Electronic packaging Materials....”
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  17. 17
    Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire /
    由 Mohd Firdaus Manap
    出版 2017
    主题: “...Wire bonding (Electronic packaging)...”
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  18. 18
    The effects of annealing, temperature and humidity on tin whiskers formation /
    由 Lee, Hua Xing
    出版 2009
    主题: “...Electronic packaging....”
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  19. 19
    A study of wire sweep during transfer molding on plastic IC packaging /
    由 Wu, Jianhua
    出版 1996
    主题: “...Electronic packaging Materials...”
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  20. 20
    Optimization of gel dispensing process in pressure sensor assembly /
    由 Shukri Nizam Mohamed Radzi
    出版 2010
    主题: “...Wire bonding (Electronic packaging)....”
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