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Showing 1 - 6 results of 6 for search '"Electronic packaging Materials."', 查詢時間: 0.03s Refine Results
  1. 1
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    由 Prakash Babu Balakrishnan
    出版 2012
    主題: “...Electronic packaging Materials....”
    Thesis 圖書
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  2. 2
    A study of wire sweep during transfer molding on plastic IC packaging /
    由 Wu, Jianhua
    出版 1996
    主題: “...Electronic packaging Materials...”
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  3. 3
    Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
    由 Tay, See Leng
    出版 2011
    主題: “...Electronic packaging Materials....”
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  4. 4
    Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
    由 Wakeel, Saif
    出版 2021
    主題: “...Electronic packaging Materials....”
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  5. 5
    An analysis of the epoxy molding compound industry /
    由 Chin, Neep Hing
    出版 1997
    主題: “...Electronic packaging Materials...”
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  6. 6
    Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
    由 Azida Azmi
    出版 2012
    主題: “...Electronic packaging Materials....”
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