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Showing 1 - 4 results of 4 for search '"Electronic packaging Reliability."', query time: 0.06s Refine Results
  1. 1
    First bonding parameter optimization in wire bonding process /
    Subjects: “...Electronic packaging Reliability....”
    Thesis Book
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  2. 2
    Optimization and reliability of wirebond looping profile for broken neck failure /
    by Teoh, Cheng Lock
    Published 2012
    Subjects: “...Electronic packaging Reliability....”
    Thesis Book
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  3. 3
    Study of improvement in wire bonding process through critical parameters analysis /
    by Ong, Siew Kee
    Published 2011
    Subjects: “...Electronic packaging Reliability....”
    Thesis Book
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  4. 4
    Study of the effect of process variation on wire bond process of IC assembly /
    by Intan Mastura Saadon
    Published 2012
    Subjects: “...Electronic packaging Reliability....”
    Thesis Book
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