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Electronic packaging
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Materials
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Wire bonding (Electronic packaging)
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Package goods industry
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Semiconductors
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Food
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Solder and soldering
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Design and construction
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Reliability
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Papaya
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Design
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Epoxy resins
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Integrated circuits
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Organizational change
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Sintering
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6by Zainal Arifin, Maryam 'AdilahSubjects: “...Food - Packaging...”
Published 2018
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Thesis -
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8by Suprammaniam, SugumarSubjects: “...Microelectronic packaging. Materials....”
Published 1997
Thesis Book -
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10Subjects: “...Wire bonding (Electronic packaging)...”
Thesis Book -
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12by Intan Mastura SaadonSubjects: “...Wire bonding (Electronic packaging)....”
Published 2012
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20by Teoh, Cheng LockSubjects: “...Wire bonding (Electronic packaging) Production control....”
Published 2012
Thesis Book